Reliability of CGA/LGA/HDI Package Board/Assembly

Reliability of CGA/LGA/HDI Package Board/Assembly (Final Report)

A reliable solderless connection technique for high I/O counts ceramic land grid array package for space applications

Article history: Received 22 May 2015 Received in revised form 17 June 2015 Accepted 18 June 2015 Available online xxxx Area Array microelectronic package with small pitch and large I/O counts is now widely used in the ceramic packaging ofmicroelectronics IntegratedCircuit (IC). This kind of LandGridArray (LGA) device cannot be directly soldered on Printed Circuit Board (PCB). In order to mount...

Defect Features Detected by Acoustic Emission for Flip-Chip CGA/FCBGA/PBGA/FPBGA Packages and Assemblies

C-mode scanning acoustic microscopy (C-SAM) is a non-destructive inspection technique showing the internal features of a specimen by ultrasound. The C-SAM is the preferred method for finding “air gaps” such as delamination, cracks, voids, and porosity. This paper presents evaluations performed on various advanced packages/assemblies especially flip-chip die version of ball grid array/column gri...

Biomechanical and histological comparison between the cryopreserved and the lyophilized Gracilis tendon allograft for MPFL reconstruction, a cadaveric experimental study

BACKGROUND Medial patellofemoral ligament (MPFL) is the main restrictor of lateral shifting of the patella, contributing by 60 % in the first 20° flexion of the knee. MPFL reconstruction has been performed in order to restore the stability of the patella with good results.Lyophilized Gracilis tendon allograft (LGA) compared to Cryopreserved Gracilis tendon allograft (CGA) has a lower cost, does...

Enabling More than Moore: Accelerated Reliability Testing and Risk Analysis for Advanced Electronics Packaging

For five decades, the semiconductor industry has distinguished itself by the rapid pace of improvement in miniaturization of electronics products—Moore’s Law. Now, scaling hits a brick wall, a paradigm shift. The industry roadmaps recognized the scaling limitation and project that packaging technologies will meet further miniaturization needs or a.k.a “More than Moore”. This paper presents pack...